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Semiconductor technology applies thermoset transfer molding

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Transfer molding with a thermosetting compound and a proprietary tool is being positioned as an alternative to use of thermoplastics and standard injection molding in the production of some semiconductor devices.

Dutch firm Sencio BV (Nijmegen) says its nCapsulate technology can deliver better isotropy and thermomechanical stability than thermoplastics and standard injection molding.

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